Leveraging the Cu2SnTe3 additive for an improved thermoelectric figure of merit and module efficiency in Bi0.5Sb1.5Te3-based composites

J. Mater. Chem. A, 2024, Advance Article
DOI: 10.1039/D4TA00552J, Paper
Qiaoyan Pan, Kaikai Pang, Qiang Zhang, Yan Liu, Huilie Shi, Jingsong Li, Wenjie Zhou, Qianqian Sun, Yuyou Zhang, Xiaojian Tan, Peng Sun, Jiehua Wu, Guo-Qiang Liu, Jun Jiang
The highly active additive Cu2SnTe3 generates multi-scale defects, effectively reducing lattice thermal conductivity. Along with optimized weighted mobility, the higher quality factor yields a competitive ZT value in the (Bi,Sb)2Te3-based composite.
To cite this article before page numbers are assigned, use the DOI form of citation above.
The content of this RSS Feed (c) The Royal Society of Chemistry