Cu-nanosphere film with a high surface area and dominant (200) facet was fabricated by a simple electrodeposition method. The Cu-nanosphere achieved excellent nitrate reduction reaction (NO₃RR), and nitrogen reduction reaction (NRR) performance. The dominance of the Cu (200) facet of the Cu-nanosphere electrocatalyst suppresses the competing hydrogen evolution reaction (HER) and thus exhibits better electrochemical NO₃RR and NRR selectivity.

Abstract

The electrochemical reduction reaction of nitrogenous species such as NO₃ ⁻ (NO₃RR) and N₂ (NRR) is a promising strategy for producing ammonia under ambient conditions. However, low activity and poor selectivity of both NO₃RR and NRR remain the biggest problem of all current electrocatalysts. In this work, we fabricated Cu-nanosphere film with a high surface area and dominant with a Cu(200) facet by simple electrodeposition method. The Cu-nanosphere film exhibits high electrocatalytic activity for NO₃RR and NRR to ammonia under ambient conditions. In the nitrate environment, the Cu-nanosphere electrode reduced NO₃ ⁻ to yield NH₃ at a rate of 5.2 mg/h cm², with a Faradaic efficiency of 85 % at −1.3 V. In the N₂-saturated environment, the Cu-nanosphere electrode reduced N₂ to yield NH₃ with the highest yield rate of 16.2 μg/h cm² at −0.5 V, and the highest NH₃ Faradaic efficiency of 41.6 % at −0.4 V. Furthermore, the Cu-nanosphere exhibits excellent stability with the NH₃ yield rate, and the Faradaic efficiency remains stable after 10 consecutive cycles. Such high levels of NH₃ yield, selectivity, and stability at low applied potential are among the best values currently reported in the literature.